Tag Archives: NYU Tandon School of Engineering

Atom-Thin Processor

An international team of researchers has reported a breakthrough in fabricating atom-thin processors — a discovery that could have far-reaching impacts on nanoscale chip production and in labs across the globe where scientists are exploring 2D materials for ever-smaller and –faster semiconductors.

The team, headed by New York University Tandon School of Engineering Professor of Chemical and Biomolecular Engineering Elisa Riedo, outlined the research results in the latest issue of Nature Electronics.They demonstrate that lithography using a probe heated above 100 degrees Celsius outperformed standard methods for fabricating metal electrodes on 2D semiconductors such as molybdenum disulfide (MoS₂). Such transitional metals are among the materials that scientists believe may supplant silicon for atomically small chips.

The team’s new fabrication method — called thermal scanning probe lithography (t-SPL) — offers a number of advantages over today’s electron beam lithography (EBL). First, thermal lithography significantly improves the quality of the 2D transistors, offsetting the Schottky barrier, which hampers the flow of electrons at the intersection of metal and the 2D substrate. Also, unlike EBL, the thermal lithography allows chip designers to easily image the 2D semiconductor and then pattern the electrodes where desired. Also, t-SPL fabrication systems promise significant initial savings as well as operational costs: They dramatically reduce power consumption by operating in ambient conditions, eliminating the need to produce high-energy electrons and to generate an ultra-high vacuum. Finally, this thermal fabrication method can be easily scaled up for industrial production by using parallel thermal probes.

Source: https://engineering.nyu.edu/

Mass Production of Low-Cost Solar Cells

An international team of university researchers today reports solving a major fabrication challenge for perovskite cells — the intriguing potential challengers to silicon-based solar cells.

These crystalline structures show great promise because they can absorb almost all wavelengths of light. Perovskite solar cells are already commercialized on a small scale, but recent vast improvements in their power conversion efficiency (PCE) are driving interest in using them as low-cost alternatives for solar panels.

In the cover article published online in Nanoscale, a publication of the Royal Society of Chemistry, the research team reveals a new scalable means of applying a critical component to perovskite cells to solve some major fabrication challenges. The researchers were able to apply the critical electron transport layer (ETL) in perovskite photovoltaic cells in a new way — spray coating — to imbue the ETL with superior conductivity and a strong interface with its neighbor, the perovskite layer.

The researchers turned to spray coating, which applies the ETL uniformly across a large area and is suitable for manufacturing large solar panels. They reported a 30 percent efficiency gain over other ETLs – from a PCE of 13 percent to over 17 percent – and fewer defects.

Added Taylor, “Our approach is concise, highly reproducible, and scalable. It suggests that spray coating the PCBM ETL could have broad appeal toward improving the efficiency baseline of perovskite solar cells and providing an ideal platform for record-breaking p-i-n perovskite solar cells in the near future.”

The research is led by André D. Taylor, an associate professor in the NYU Tandon School of Engineering’s Chemical and Biomolecular Engineering Department, with Yifan Zheng, the first author on the paper and a Peking University researcher. Co-authors are from the University of Electronic Science and Technology of China, Yale University, and Johns Hopkins University.

Source: https://engineering.nyu.edu/